Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 33 items
Printed circuit board materials that combine whiteness and high thermal conductivity.
It was developed to incorporate LED components. It is a printed circuit board material that is white and has excellent thermal conductivity (1.3W/mk). It has obtained UL94/V-0 certification.
A rich lineup. Widely adopted for LED lighting and automotive applications.
This is a highly thermally conductive printed circuit board material designed to accommodate components that emit high heat during operation, such as high-brightness LEDs and power semiconductors. It has been on the market for 20 years, and the lineup has been enriched, receiving many adoptions.
Achieves 10 times the thermal conductivity compared to conventional printed circuit board materials!
The heat emitted by high-brightness LEDs and power devices destabilizes their operation and accelerates the degradation of surrounding materials such as substrates and encapsulating resins. Therefore, substrate materials are required to efficiently transfer heat to the casing and heat sinks. High thermal conductivity printed circuit board materials support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors, with a thermal conductivity that is ten times greater than that of standard printed circuit board materials (FR-4). ------------------------------【Features】--------------------------------- ■ Achieves a thermal conductivity of 3.0 W/mK with glass cloth ■ Can be made thin, thus supporting thermal management from the aspect of "reducing thermal resistance" ---------------------------------------------------------------------------
It suppresses warping during reflow.
- The bending elastic modulus at high temperatures is very high, reducing warping during reflow. - The handling properties are good when processing thin substrates. - It is a high heat-resistant material while also exhibiting excellent moisture-resistant solder heat resistance. - The composition of the insulating layer is uniform, resulting in good laser processing capabilities. - It is an environmentally friendly substrate material that is halogen-free, phosphorus-free, and free of metal oxides.
It is a printed circuit board material for high-capacity and high-speed communication devices such as base station antennas and high-speed servers and routers.
With the spread of smartphones and tablet devices, the equipment that makes up broadband systems is required to process large amounts of data at high speeds. Additionally, to enhance "connectivity" and expand coverage areas, the installation and upgrading of base stations are being advanced. In response to this, Rishou Industry has prepared printed circuit board materials that have a fast signal propagation speed (low dielectric constant) and a function to minimize transmission loss (low dielectric loss tangent).
It was developed for mobile phone base station antenna substrates.
The substrate glass fabric uses general-purpose E-glass, which offers excellent cost performance.
Offered at about half price for millimeter-wave radar substrates.
The printed circuit board materials for millimeter-wave radar substrates require the performance of "low transmission loss," which has led to the prevalence of expensive PTFE (polytetrafluoroethylene) and LPC (liquid crystal polymer) based materials. CS-3379M is based on the more affordable PPE (polyphenylene ether) and achieves low transmission loss. It is expected to offer low transmission loss performance comparable to PTFE substrates while being available at about half the price.
Effective measures against solder cracks.
When surface mount components are soldered onto an aluminum base printed circuit board, the aluminum plate repeatedly expands and contracts due to heat, causing stress to accumulate at the solder joints, leading to fatigue failure (solder cracks). The insulation layer of AC-7302 is very soft (low elasticity), which can help alleviate the stress on the solder joints.
A thermal conductivity that is 6 times or 10 times that of the general FR-4 type.
Glass fabric substrate epoxy resin printed circuit board materials are referred to as FR-4 in the industry. The thermal conductivity of standard FR-4 is about 0.3 W/mK. In contrast, Risholite high thermal conductivity FR-4 offers a lineup with thermal conductivities of 1.8 W/mK, which is six times that of standard products, and 3 W/mK, which is ten times higher. Since heat dissipation substrates can be manufactured using existing equipment, we have received many adoptions.
Proposal for the miniaturization of millimeter-wave antennas.
This is a printed circuit board material with high dielectric constant (Dk=11.3) and low dielectric loss tangent (Df=0.003). It is a type reinforced with glass cloth using PPE resin (polyphenylene ether), allowing the use of existing machinery and know-how for processing glass epoxy type printed circuit boards (FR-4). We also have prepreg for multilayering (ES-3346) and interlayer adhesive sheets (AD-3396).
We will provide the best proposals from a rich variety of products created by a spirit of inquiry and a wide range of handled items.
Mazda Engineering Co., Ltd. sells various plastic materials such as MC nylon, polyacetal, PEEK, PVC, acrylic, and Teflon. We also accept processing of various plastic materials, catering to a wide range of needs from small quantities to mass production. Please provide your desired drawings, materials, and quantities, and we will promptly provide you with a quote. We offer various materials for printed circuit boards used in devices such as computers, digital cameras, and mobile phones, including shield plates, multilayer boards, and double-sided boards. Additionally, we handle auxiliary materials, equipment, and devices related to the electronic industry involved in their manufacturing. For more details, please contact us or refer to our catalog.
Stable thermal conductivity of over 600 W/(m·K)! Capable of high-temperature (800℃) silver brazing.
"Ag-Diamond" is a composite material of silver and diamond. It has a higher thermal conductivity (600W/(m·K)) than "Cu-Diamond" and is applicable for large area applications of 50×50mm². In addition to being able to be plated with Ni or Ni/Au on the surface, it also supports high-temperature (800℃) silver brazing. 【Features】 ■ Stable high thermal conductivity of over 600W/(m·K) ■ Surface can be plated with Ni or Ni/Au ■ Supports high-temperature (800℃) silver brazing *For more details, please refer to the PDF document or feel free to contact us.
By reducing the thickness of the insulation layer, high heat dissipation can be achieved! Ultra-thin heat dissipation substrate material.
"Yupicel(R) H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. 【Features】 ■ Ultra-thin heat dissipation substrate material ■ Super lightweight heat dissipation substrate material ■ Roll processing through a unique continuous manufacturing method ■ Three-dimensional processing capability ■ Halogen-free, UL94V-0 certified (E319042) (Contains no ceramic fillers, has good machinability, suitable for bare chip mounting COB) *For more details, please download the PDF or feel free to contact us.
For AFM/SPM sample substrates! Atomically flat mica and HOPG.
This is a high-precision substrate material essential for the preparation of SPM and AFM samples. The first step to successfully conducting AFM and SPM measurements is to prepare a flat substrate. The mica and HOPG supplied by our company have sufficient precision to securely hold AFM and SPM samples. We also offer stainless steel surface-polished metal discs for fixing the substrate to the measurement device, as well as double-sided tape. High-precision mica substrates: Φ10, 12, 15, 20, 25mm V-1 grade High-precision HOPG substrates: 10x10mm thickness 1mm or 2mm MS values 0.4°, 0.8°, 3.5° Metal discs for substrate fixation: Φ10, 12, 15, 20mm stainless steel with gold coating option available Conductive double-sided tape for substrate fixation and non-conductive double-sided tape.
![Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]](https://image.mono.ipros.com/public/product/image/6fa/2000312615/IPROS849729614625668075.PNG?w=280&h=280)
Ultra-thin, lightweight heat dissipation substrate without adhesive type! Since three-dimensional processing is possible, substrates of various shapes can be produced!
Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be three-dimensionally processed, making it a suitable material for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ It allows for three-dimensional processing, enabling the production of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, providing excellent machinability. ■ It is suitable for bare chip mounting COBs. *For more details, please request materials or view the PDF data available for download.
